In recent years, significant breakthroughs have been made in the application of polysilazane in the microelectronics field. Its excellent insulation properties and high-temperature stability make it an ideal material for integrated circuit packaging and semiconductor devices. As microelectronics technology moves toward miniaturization and higher integration, the demand for polysilazane continues to grow.

Polysilazane can be used to manufacture high-performance packaging materials, effectively improving the reliability and durability of electronic devices. Additionally, its applications in photoresists and shallow trench isolation materials have further advanced semiconductor manufacturing technology.

Experts point out that the application of polysilazane in the microelectronics field will become even more widespread in the future. With continuous technological optimization, its potential in emerging fields such as 5G communication and artificial intelligence will also be fully realized.

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